With the arrival of the 5G technology era, the demand for new generation network communication servers, switches, and small cells has seen explosive growth. The design of power supplies is trending toward high power, ultra-compact, and light-weight models, which poses significant challenges in terms of heat dissipation.
For years, Asian Power Devices, Inc. (APD) been able to provide optimal heat dissipation solutions by using its highly reliable computer-aided heat flow engineering and adopting systematic, swift, and accurate heat dissipation designs.
APD’s CAE (ANSYS ICEPAK) heat dissipation design has the following features:
High accuracy prediction of rise in temperature
By combining the Dissipation Engineering Team’s exclusive and sophisticated thermal model set-up with the high-accuracy dissipation calculation conducted by the Electronic Design Team, APD is able to accurately predict the rise in temperature of key PSU components with a deviation of ±5%. APD can accurately analyze overheating and product life risks for transformers, inductors, MOS diodes, capacitors, resistance sensors, and provide effective solutions.
Rapid assessment of multiple heat dissipation solutions
APD highly prioritizes heat dissipation in its product designs. With the help of CAE systems, we are able to effectively perform the following tasks:
- Layout assessment:
Optimized component layout strategies with a better heat dissipation are proposed in the early stages of PCB layout. Moreover, further fine-tuning for each individual component can be conducted in later stages to optimize overall heat dissipation.
- New material applications:Gaining understanding on the properties of new materials is imperative for innovative R&D. In order to meet various needs of its client, APD has recently assessed the application of thermal conductivity/heat dissipation materials, such as TCP, graphene coating and thermal gel.
- Assessment of worst case scenarios:For example, if the size of the heat dissipation fin is maintained below minimum tolerance, assessments are conducted on the reduction of heat dissipation performance, thereby ensuring the reliability of the heat dissipation design.
Ultra-compact & light weight
By incorporating its comprehensive development workflow with its innovative thermal flow R&D momentum and rapid CAE assessment, APD is able to properly solve heat dissipation issues caused by downsizing of large wattage power supplies. Successful cases include the 260W (fanless), the 500W, and the 950W. In the future, this technology will be implemented in the medical open-frame power supply market as well.
Assisting clients in conducting diverse application analyses
The scope of new-generation network communication applications is more diverse than ever, which is why heat dissipation requirements are becoming an increasingly complicated issue. APD focuses on the customization of power supplies and is capable of assisting clients with a multitude of PSU application scenario analyses within the system; including analysis on an array of internal and external conditions such as system air passages, fans, layout, altitude and isolation, producing power supplies with enhanced excellence.
CAE Optimized New Generation Power Supply